CALLTECH CONNECTYour privacy choices

Privacy policy

CallTech Connect
Join free
OFFICIAL PUBLIC PROCUREMENTUnited KingdomOPEN NOTICE

CSAC2334 Thermal Interface Material (TiM) reliability tester

Semiconductor Catapult · UK Find a Tender

Bid deadline2 December 2026 at 11:00 UTC
Disclosed estimated contract value£100,000
Published10 Nov 2026
Source checked10 Nov 2026

What is this opportunity?

Semiconductor Catapult is interested in Ai characterisation tools and hardware and data centre applications. Thermal management is part of this scope and vision. We would like to expand our capabilities by installing a thermal interface materials reliability tester that is capable of adjusting the bond line measurements and adjusting the pressure applied for each test. The reliability of Thermal interface materials is important for data centre applications.

Summary and deadlines come from the named official feed. Always confirm amendments, timezone, supplier eligibility, and submission requirements directly with the issuing organisation.

Original notice and documents

Browsing the original government notice and obtaining publicly available bidding documents from the issuing authority remain free. Some buyer portals require their own supplier registration.

Issuing organisation
Semiconductor Catapult
Official source
UK Find a Tender
Notice identifier
ocds-h6vhtk-07b8cc
Source document files verified for compilation
Not yet available
Open source notice and published buyer instructions ↗

Preview the ZIP tender briefing

The free sample ZIP includes a source-attributed notice summary, a bidding checklist and a source-link manifest. It does not contain the buyer's complete bidding attachments.

Download sample ZIP

Pack content is not official advice and is not a bid submission. Full document ZIPs are provided only when official files are verified, reusable and complete; paid checkout remains disabled until payment acceptance passes.

CSAC2334 Thermal Interface Material (TiM) reliability tester | CallTech Connect Global